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I E C 60 7 47 -1 6-1
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I E C 60 7 47 -1 6-1
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Edition 1 .2 201 7-02

C ON S OLI D ATE D
VE RS I ON

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C ON S OLI D É E

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S em i con d u ctor d evi ce s –
P art 1 6-1 : M i crowave i n teg rated ci rcu i ts – Am pl i fi e rs

D i s pos i ti fs à s e m i con d u cte u rs –
P arti e 1 6-1 : C i rcu i ts i n té g rés h ype rfréq u e n ce s – Am pl i fi cate u rs

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I E C 60 7 47 -1 6-1
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VE RS I ON RE D LI N E
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S e m i con d u ctor d e vi ces –
P art 1 6-1 : M i crowave i n teg rated ci rcu i ts – Am pl i fi ers

D i s pos i ti fs à s e m i con d u cte u rs –

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P arti e 1 6-1 : C i rcu i ts i n té g rés h yperfréq u en ce s – Am pl i fi cateu rs


–2–

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

CONTENTS
FOREWORD ... ... ... ... ... ... ... .. ... ... ... ... ... ... . .. ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. . ... ... ... ... ... ... .. ... ... ... 7
1 Scope . ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... . .. ... ... ... ... ... ... ... .. ... ... 9
2 Normative references ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . 9
3 Terminolog y Term s and definitions . ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... . 1 0
4 Essential ratings and characteristics .. ... .. ... ... ... ... ... ... ... ... ... . .. ... ... ... ... ... .. ... ... ... ... ... ... ... ... . 1 2
4. 1 General .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 1 2
4. 1 . 1 Circuit identification and types ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... . .. ... ... ... ... ... ... .. 1 2
4. 2 Application related description .. ... ... ... ... ... ... ... ... ... ... ... ... . .. .. ... ... ... ... ... ... ... ... ... ... ... ... 1 3
4. 2. 1 Conformance to system and/or interface inform ation ... ... ... ... ... ... ... .. ... ... ... . 1 3
4. 2. 2 Overall block diagram ... ... ... ... ... ... ... ... ... ... ... ... ... ... . . ... ... ... ... ... ... ... ... ... ... ... ... 1 3
4. 2. 3 Reference data ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... .. . ... ... ... .. ... ... ... ... ... ... ... ... ... ... .. 1 3
4. 2. 4 Electrical com patibility .. ... ... ... ... ... ... ... ... ... ... ... .. . ... .. ... ... ... ... ... ... ... ... ... ... ... ... 1 3
4. 2. 5 Associated devices .. ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... 1 4
4. 3 Specification of the function .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 1 4
4. 3. 1 Detailed block diagram – Functional blocks . ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. 1 4
4. 3. 2 I dentification and function of terminals . ... ... ... ... ... ... ... ... ... .. ... ... ... .. . ... ... ... ... . 1 4
4. 3. 3 Functional description... ... .. ... ... ... ... ... ... ... ... ... ... .. . ... ... ... .. ... ... ... ... ... ... ... ... ... . 1 5
4. 3. 4 Famil y-related characteristics . .. ... ... ... ... ... ... ... ... ... ... .. . ... ... ... .. ... ... ... ... ... ... ... 1 5
4. 4 Limiting values (absolute m axim um rating system) .. ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... .. 1 5
4. 4. 1 Electrical lim iting values . ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . 1 6
4. 4. 2 Tem peratures .. ... ... ... ... .. ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... .. . .. 1 6
4. 5 Operating conditions (within the specified operating temperature range) ... ... ... ... ... 1 7
4. 5. 1 Power supplies positive and/or negative values ... ... ... .. ... ... ... ... ... ... ... ... ... ... 1 7
4. 5. 2 I nitialization sequences (where appropriate) ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. 1 7
4. 5. 3 I nput voltage(s) (where appropriate) . ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... . 1 7
4. 5. 4 Output current(s) (where appropriate) ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 1 7
4. 5. 5 Voltage and/or current of other term inal(s) .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. .. 1 7
4. 5. 6 External elements (where appropriate) ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... . .. . 1 7
4. 5. 7 Operating temperature range ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... .. 1 7

4. 6 Electrical characteristics . ... ... ... .. ... ... ... ... ... ... ... .. . ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... .. 1 7
4. 6. 1 Static characteristics . ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... 1 7
4. 6. 2 Dynam ic or a. c. characteristics .. ... ... ... ... ... ... ... .. ... ... ... . .. ... ... ... ... ... ... ... ... ... .. 1 8
4. 7 Mechanical and environmental ratings, characteristics and data ... ... ... ... .. ... ... ... ... .. 1 9
4. 8 Additional information .. ... ... ... ... ... ... ... ... ... ... ... ... . . ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... .. 1 9
4. 8. 1 Equivalent input and output circuit .. ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 1 9
4. 8. 2 I nternal protection ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... . .. ... ... ... ... ... ... ... .. ... ... ... 1 9
4. 8. 3 Capacitors at term inals . ... ... ... ... ... .. ... ... ... ... ... ... ... .. . ... ... ... ... ... ... ... .. ... ... ... ... . 1 9
4. 8. 4 Therm al resistance .. .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... 1 9
4. 8. 5 I nterconnections to other types of circuit .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. .. 1 9
4. 8. 6 Effects of externall y connected component(s) . ... ... ... ... ... .. ... ... ... ... ... ... .. . ... .. 1 9
4. 8. 7 Recomm endations for any associated device(s) .. ... ... .. ... ... ... ... ... ... ... ... ... ... 1 9
4. 8. 8 Handling precautions . ... ... ... ... ... ... ... ... ... ... ... ... .. . ... .. ... ... ... ... ... ... ... ... ... ... ... ... 1 9
4. 8. 9 Application data .. ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... .. 20
4. 8. 1 0 Other application information ... .. ... ... ... ... ... ... ... ... ... ... ... . .. ... ... ... .. ... ... ... ... ... .. 20
4. 8. 1 1 Date of issue of the data sheet .. ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. . ... ... ... ... .. 20
5 Measuring m ethods ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... . .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . . 20
5. 1 General .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 20
5. 1 . 1 Characteristic impedances . ... ... ... ... ... ... ... ... ... ... ... .. ... . .. ... ... ... ... ... ... ... ... ... ... . 20
5. 1 . 2 General precautions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 20
5. 1 . 3 Handling precautions . ... ... ... ... ... ... ... ... ... ... ... ... .. . ... .. ... ... ... ... ... ... ... ... ... ... ... ... 20
5. 1 . 4 Types . ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. .. . . 20


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5. 2 Linear (power) gain ( G lin ) .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... .. 20
5. 2. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 20
5. 2. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 21

5. 2. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 21
5. 2. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 21
5. 2. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 21
5. 2. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 22
5. 2. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 22
5. 3 Linear (power) gain flatness ( ∆ G lin ) .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... .. 22
5. 3. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 22
5. 3. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 22
5. 3. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 22
5. 3. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 22
5. 3. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 22
5. 3. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 22
5. 3. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 23
5. 4 Power gain ( G p ) ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... . . ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... . 23
5. 4. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 23
5. 4. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 23
5. 4. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 23
5. 4. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 23
5. 4. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 23
5. 4. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 23
5. 4. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 23
5. 5 (Power) gain flatness ( ∆ Gp ) . .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. .. . ... ... ... ... ... ... ... ... ... ... ... 24
5. 5. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 24
5. 5. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 24
5. 5. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 24
5. 5. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 24
5. 5. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 24
5. 5. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 24
5. 5. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 24
5. 6 (Maxim um available) gain reduction ( ∆ G red ) ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... . .. ... . 25

5. 6. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 25
5. 6. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 25
5. 6. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 25
5. 6. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 25
5. 6. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 25
5. 6. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 25
5. 6. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 25
5. 7 Limiting output power ( P o(ltg) ) and limiting output power flatness ( ∆ Po(ltg) ) ... ... ... . 25
5. 7. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 25
5. 7. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 26
5. 7. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 26
5. 7. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 26
5. 7. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 26
5. 7. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 26
5. 7. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 26
5. 8 Output power ( P o ) . ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... .. 26
5. 8. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 26
5. 8. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 26
5. 8. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 26
5. 8. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 27
5. 8. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 27
5. 8. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 27


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5. 9

5. 1 0

5. 1 1

5. 1 2

5. 1 3

5. 1 4

5. 1 5

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5. 8. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 27
Output power at 1 dB gain com pression ( P o(1 dB) ) .. ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... .. 27
5. 9. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 27
5. 9. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 27
5. 9. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 27
5. 9. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 27
5. 9. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 27
5. 9. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 27
5. 9. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 28
Noise figure ( F) ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... . 28
5. 1 0. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 28
5. 1 0. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 28
5. 1 0. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 28
5. 1 0. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 29
5. 1 0. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 29
5. 1 0. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 29
5. 1 0. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 30
I nterm odulation distortion (two-tone) ( Pn /P 1 ) . ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. . 30

5. 1 1 . 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 30
5. 1 1 . 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 30
5. 1 1 . 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 30
5. 1 1 . 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 31
5. 1 1 . 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 31
5. 1 1 . 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 31
5. 1 1 . 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 31
Power at the intercept point (for intermodulation products) ( P n(I P) ) ... .. ... ... ... ... ... ... 31
5. 1 2. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 31
5. 1 2. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 32
5. 1 2. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 32
5. 1 2. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 32
5. 1 2. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 32
5. 1 2. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 32
5. 1 2. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 32
Magnitude of the input reflection coefficient (input return loss) (  s 1 1  | S1 1 ) .. ... ... ... . 32
5. 1 3. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 32
5. 1 3. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 33
5. 1 3. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 33
5. 1 3. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 33
5. 1 3. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 33
5. 1 3. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 33
5. 1 3. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 34
Magnitude of the output reflection coefficient (output return loss) (  s 22  S22 ) . ... ... . 34
5. 1 4. 1 Magnitude of the output reflection coefficient (output return loss)
under small-signal operating condition . ... ... ... ... ... ... ... ... ... .. ... ... ... .. . ... ... ... ... . 34
5. 1 4. 2 Magnitude of the output reflection coefficient (output return loss)
under large-signal operating condition . ... ... ... ... ... ... ... ... ... .. ... ... ... .. . ... ... ... ... . 35
Magnitude of the reverse transm ission coefficient (isolation) (  s 1 2  S1 2 ) . ... ... ... ... .. 37
5. 1 5. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 37

5. 1 5. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 38
5. 1 5. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 38
5. 1 5. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 38
5. 1 5. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 38
5. 1 5. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 38
5. 1 5. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 39
|

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I EC 60747-1 6-1 :2001 +AMD1 : 2007
–5–
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5. 1 6 Conversion coefficient of amplitude modulation to phase m odulation
( α (AM-PM) ) ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... . .. ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... .. . ... . 39
5. 1 6. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 39
5. 1 6. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 39
5. 1 6. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 39
5. 1 6. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 40
5. 1 6. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 40
5. 1 6. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 40
5. 1 6. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 40
5. 1 7 Group delay tim e ( td(grp) ) ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... 40

5. 1 7. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 40
5. 1 7. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 41
5. 1 7. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 41
5. 1 7. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 41
5. 1 7. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 41
5. 1 7. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 41
5. 1 7. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 41
5. 1 8 Power added efficiency ( η add ) . ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... . 42
5. 1 8. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 42
5. 1 8. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 42
5. 1 8. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 42
5. 1 8. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 43
5. 1 8. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 43
5. 1 8. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 43
5. 1 8. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 43
5. 1 9 n th order harmonic distortion ratio ( P nth / P 1 ) .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... 43
5. 1 9. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 43
5. 1 9. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 44
5. 1 9. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 44
5. 1 9. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 44
5. 1 9. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 44
5. 1 9. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 44
5. 1 9. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 45
5. 20 Output noise power ( PN ) . ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... 45
5. 20. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 45
5. 20. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 45
5. 20. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 45
5. 20. 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 46
5. 20. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 46
5. 20. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 46

5. 20. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 46
5. 21 Spurious intensity under specified load VSWR ( Psp / P o ) . ... ... ... ... ... ... ... ... ... .. ... ... ... . 47
5. 21 . 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 47
5. 21 . 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 47
5. 21 . 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 47
5. 21 . 4 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 47
5. 21 . 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 47
5. 21 . 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 48
5. 21 . 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 48
5. 22 Adjacent channel power ratio ( Padj /P o(mod) ) . ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. 48
5. 22. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 48
5. 22. 2 Circuit diagram ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 49
5. 22. 3 Principle of measurement .. ... ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... .. . ... ... ... ... ... ... ... . 49
5. 22. 4 Circuit description and requirem ent ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... 50
5. 22. 5 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 50


–6–

6

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7
5. 22. 6 Measurement procedure .. ... ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... .. ... ... ... ... . 50
5. 22. 7 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 50
Verifying methods . ... ... ... ... ... ... ... .. ... ... ... ... ... ... . .. ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... .. . ... ... ... ... 51
6. 1 Load m ismatch tolerance ( Ψ L ) ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... .. 51
6. 1 . 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 51
6. 1 . 2 Verification of method 1 (spurious intensity) ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. 51
6. 1 . 3 Verification of method 2 (no discontinuity of the frequency response) . ... ... . 53

6. 2 Source mism atch tolerance ( Ψ S ) .. ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. 54
6. 2. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 54
6. 2. 2 Verification of method 1 (spurious intensity) ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. 54
6. 2. 3 Verifying method 2 (no discontinuity of the frequency response) . ... ... ... ... ... 55
6. 3 Load m ismatch ruggedness ( Ψ R ) ... ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... . .. ... ... ... ... .. ... ... . 56
6. 3. 1 Purpose . ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... . 56
6. 3. 2 Circuit diagram .. ... ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... .. . ... ... ... ... ... ... ... ... ... .. ... ... ... 57
6. 3. 3 Circuit description and requirem ents .. ... ... ... .. ... ... ... ... ... ... ... ... . .. ... ... ... ... ... ... 57
6. 3. 4 Precautions to be observed .. ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. . .. ... ... ... ... ... .. 57
6. 3. 5 Test procedure ... ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... . .. ... .. ... ... ... ... ... ... ... ... ... ... .. 57
6. 3. 6 Specified conditions .. ... ... ... ... ... ... ... ... ... ... ... ... ... ... .. ... .. . ... ... ... ... ... ... ... ... ... ... 58

Figure 1 – Circuit for the measurem ents of linear gain .. ... ... ... ... ... ... .. ... ... ... ... ... ... ... ... ... .. . ... ... 21
Figure 2 – Basic circuit for the m easurem ent of the noise figure ... ... ... ... ... ... ... ... .. ... ... ... ... ... .. 28
Figure 3 – Basic circuit for the m easurem ents of two-tone intermodulation distortion ... ... ... ... 30
Figure 4 – Circuit for the measurem ents of magnitude of input/output reflection
coefficient (input/output return loss) .. ... ... ... ... ... .. ... ... ... ... ... ... ... ... .. . ... ... ... ... ... .. ... ... ... ... ... ... ... .. 33
Figure 5 – Circuit for the m easurem ent of output reflection coefficient . ... ... ... ... ... ... ... ... ... ... .. . 36
Figure 6 – Circuit for the measurem ent of isolation .. ... ... ... ... ... ... ... ... ... .. ... ... ... ... ... ... .. . ... ... ... .. 38
Figure 7 – Basic circuit for the m easurem ent of α (AM-PM) ... ... ... .. ... ... ... ... ... ... ... ... ... ... ... ... ... . 39
Figure 8 – Circuit for the measurem ent of the power added efficiency ... ... ... ... .. ... ... ... ... ... ... ... 42
Figure 9 – Circuit for the measurem ents of the n th order harmonic distortion ratio .. ... ... .. ... ... 44
Figure 1 0 – Circuit diagram for the measurem ent of the output noise power ... ... ... ... ... ... ... .. .. 45
Figure 1 1 – Circuit diagram for the measurement of the spurious intensity . .. ... ... ... ... ... ... ... ... . 47
Figure 1 2 – Circuit for the measurem ent of the adjacent channel power ratio .. ... ... ... ... ... ... ... . 49
Figure 1 3 – Circuit for the verification of load mism atch tolerance in m ethod 1 ... ... ... ... .. ... ... 51
Figure 1 4 – Circuit for the verification of load m ismatch tolerance in m ethod 2 . ... ... ... ... ... ... .. 53
Figure 1 5 – Circuit for the verification of source mism atch tolerance in method 1 . ... ... ... .. ... ... 54
Figure 1 6 – Circuit for the verification of source mism atch tolerance in m ethod 2 ... ... ... .. ... ... 55
Figure 1 7 – Circuit for the verification of load m ism atch ruggedness .. ... ... ... ... .. ... ... ... ... ... ... ... 57

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

–7–

INTERNATI ONAL ELECTROTECHNI CAL COMMISSI ON
____________
S E M I C O N D U C T O R D E VI C E S –

P a rt 1 6 -1 :

M i c ro w a ve i n te g ra te d c i rc u i ts – Am p l i fi e rs

FOREWORD
1 ) The I nternati on al Electrotech ni cal Comm ission (I EC) is a worl d wid e organization for stand ardization com prisin g
all nati on al el ectrotechnical comm ittees (I EC Nation al Comm ittees). The object of I EC is to prom ote
internati onal co-operation on all qu estions concerni ng standardi zati on in the electrical and electronic fields. To
this end and in ad dition to other activities, I EC pu blish es I nternational Stan dards, Techn ical Specificati ons,
Technical Reports, Publicly Avail abl e Specificati ons (PAS) an d Gui des (hereafter referred to as “I EC
Publication(s)”). Th eir preparation is entrusted to technical comm ittees; any I EC N ation al Comm ittee interested
in the subj ect dealt with m ay participate i n this preparatory work. I ntern ational, governm ental and nongovernm ental org ani zations li aising with th e I EC also partici pate i n this preparati on. I EC collaborates closel y
with the I ntern ational Organization for Stand ardization (I SO) in accordance with conditions determ ined by
agreem ent between th e two organi zati ons.
2) The form al decisions or ag reem ents of I EC on tech nical m atters express, as nearly as possi ble, an international
consensus of opinion on the rel evant subjects since each technical com m ittee has representati on from all
interested I EC N ational Com m ittees.
3) I EC Publicati ons have the form of recom m endations for i ntern ational use an d are accepted by I EC N ational
Com m ittees in that sense. While all reasonable efforts are m ade to ensure that the tech nical content of I EC

Publications is accurate, I EC cann ot be held responsibl e for th e way in which they are used or for an y
m isinterpretation by an y end u ser.
4) I n ord er to prom ote internati onal u niform ity, I EC Nation al Com m ittees undertake to appl y I EC Publ ications
transparentl y to th e m axim um extent possibl e in thei r n ational an d regi onal pu blicati ons. Any di vergence
between any I EC Publ ication and the correspondi ng n ational or regi on al pu blicati on shall be clearl y in dicated in
the latter.
5) I EC itself d oes not provid e an y attestati on of conform ity. I n depend ent certificati on bod ies provi de conform ity
assessm ent services an d, in som e areas, access to I EC m arks of conform ity. I EC is not responsi ble for an y
services carri ed out by ind ependent certification bodi es.
6) All users shou ld ensure that th ey h ave the l atest editi on of thi s publicati on.
7) No liability shall attach to I EC or its directors, em ployees, servants or ag ents includ ing i n divi dual experts and
m em bers of its tech nical com m ittees and I EC Nati on al Com m ittees for an y person al i nju ry, property dam age or
other dam age of an y nature whatsoever, wheth er di rect or indirect, or for costs (includi ng leg al fees) an d
expenses arisi ng out of th e publ ication, use of, or rel ian ce upon, this I EC Pu blicati on or an y other I EC
Publications.
8) Attention is drawn to the Norm ative references cited i n this publ ication. Use of the referenced publications is
indispensable for the correct appl icati on of this publication.
9) Attention is drawn to th e possibility that som e of the elem ents of this I EC Publication m ay be the subject of
patent rig hts. I EC shall not be held responsibl e for identifyi ng any or all such patent ri ghts.
D I S C L AI M E R
Th i s

C o n s o l i d a te d

u s er

co n ven i en c e .

v e rs i o n
On l y

is

th e

n ot

a re t o b e c o n s i d e re d t h e o ffi c i a l

Th i s C on so l i d ated
th e

fi rs t e d i t i o n

(2 0 0 7 -0 1 )

v e rs i o n

( 2 0 0 1 -1 1 )

[d o cu m en ts

4 7 E / 5 0 0 /C D V

base ed i ti on

and

In

th i s

Re d l i n e

m o d i fi e d

by

s t ri k e t h ro u g h

o ffi c i a l

of I EC

6 0 7 47 -1 6 -1

[d o cu m en ts

an d

IEC

v e rs i o n s

S t a n d a rd

of

th e

an d

h as

s t a n d a rd

and

b een
i ts

p re p a re d

fo r

am e n d m e n t( s )

d o cu m e n ts .

4 7 E /3 0 5 / F D I S

[d ocu m en ts

is

an

c u rre n t

b e a rs t h e e d i t i o n

4 7 E /2 0 0 / F D I S

and

an d

4 7 E / 3 1 7 /R VD ]

4 7 E / 5 1 8 / R VC ] .

Th e

n u mber 1 . 2.

4 7 E / 2 0 4 / RV D ] ,
an d

tech n i cal

i ts

i ts

I t con s i s ts of
am en d m en t 1

am en d m en t

con ten t

is

2

( 2 0 1 7 -0 2 )

i d e n ti ca l

to

th e

i ts am e n d m e n ts .

v e rs i o n ,

a

v e rt i c a l

a m en d m en ts

re d

te xt .

i n th i s p u b l i cati on .

A

1

line

an d

s e p a ra t e

in

2.

Fi n al

th e

m a rg i n

Ad d i t i o n s
v e rs i o n

s h o ws

a re

wi th

in

al l

w h e re

g re e n

ch an g e s

th e

t e xt ,

tech n i cal
d e l e ti o n s

accepted

is

con ten t
a re

in

avai l abl e


–8–

I EC 60747-1 6-1 : 2001 +AMD1 : 2007

+AMD2: 201 7 CSV © I EC 201 7
I nternational Standard I EC 60747-1 6-1 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of I EC technical com mittee 47: Sem iconductor devices.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the I SO/I EC Directives, Part 3.
The committee has decided that the contents of the base publication and its am endm ents will
remain unchanged until the stability date indicated on the I EC web site under
"http://webstore. iec.ch" in the data related to the specific publication. At this date, the
publication will be
•
reconfirmed,
•
withdrawn,
•
replaced by a revised edition, or
•
amended.

I M P O R T AN T
th a t

it

–

Th e

co n ta i n s

u n d e rs t a n d i n g

c o l o u r p ri n t e r.

of

' co l ou r
c o l o u rs
i ts

in si de'
wh i ch

c o n te n ts .

l og o
a re

U s e rs

on

th e

cover

c o n s i d e re d
sh ou l d

p ag e
to

t h e re fo re

of th i s
be

p ri n t

p u b l i cati on

u s e fu l
th i s

fo r

i n d i c ate s

th e

d o cu m e n t

c o rre c t
u si n g

a


I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

–9–

S E M I C O N D U C T O R D E VI C E S –

P a rt 1 6 -1 :

1

M i c ro w a ve i n te g ra te d c i rc u i ts – Am p l i fi e rs

S cop e

This part of I EC 60747 provides the terminology, the essential ratings and characteristics, as
well as the m easuring m ethods for integrated circuit m icrowave power am plifiers.
2

N o rm a t i ve re fe re n c e s

The following norm ative documents contain provisions which, through reference in this text,
constitute provisions of this part of I EC 60747. For dated references, subsequent amendments to, or revisions of, an y of these publications do not apply. H owever, parties to
agreem ents based on this part of I EC 60747 are encouraged to investigate the possibility of
applying the m ost recent editions of the norm ative documents indicated below. For undated
references, the latest edition of the norm ative docum ent referred to applies. Mem bers of I EC
and I SO m aintain registers of currentl y valid I nternational Standards.
I EC 60050-702,

In tern a tion a l Electrotechn ica l Vo ca b ula ry – Ch a pte r 702: Oscilla tion s, sign a ls

(available at: http: //www. electropedia.org)

a n d re la te d de vice s

I EC 6061 7-1 2: 1 997,

Gra ph ica l sym bols for dia gra ms – Pa rt 1 2: Bin a ry logic e lem e n ts

I EC 6061 7-1 3: 1 993,

Gra ph ica l sym bo ls for dia gra ms – Pa rt 1 3: A n a logue e lem e n ts

I EC 6061 7,

Gra p h ica l symb ols for dia gra ms

(available at: <http: //std. iec.ch/iec6061 7>)

I EC 60747-1 : 1 983 2006, Sem icon ductor devices
I EC 60747-1 : 2006/AMD1 :201 0
I EC 60747-4: 2007,

– Discrete devices – Pa rt 1 : Ge n era l

Sem icon ductor device s – Discre te device s – Pa rt 4: Microwa ve diodes a n d

tra n sistors

I EC 60747-4: 2007/AMD1 : 201 7
I EC 60747-7: 2000,
I EC 60748-2: 1 997,

Se m icon ductor devices – Pa rt 7: Bipola r tra n sistors

Se m icon ductor device s – In tegra te d circuits – Pa rt 2: Digita l in tegra te d

circuits

I EC 60748-3: 1 986,

Sem icon ductor devices – In te gra ted circuits – Pa rt 3: A n a logue in te gra ted

circuits

I EC 60748-3: 1 986/AMD1 :1 991
I EC 60748-3: 1 986/AMD2:1 994
I EC 60748-4: 1 997,

Se m icon ductor devices – In te gra ted circuits – Pa rt 4 : In terfa ce in te gra te d

circuits

I EC/TS 61 340-5-1 ,

Ele ctrosta tics - Pa rt 5-1 : Prote ctio n of e lectron ic de vice s from e lectrosta tic

ph e n om e n a - G e n e ra l re quire me n ts


– 10 –

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

I EC/TS 61 340-5-2 , Electrostatics - Part 5-2: Protection of electronic devices from electrostatic
phenomena - User guide

3

Termi nol og y Terms and defi ni ti on s

For the purposes of this document, the following terms and definitions apply.
3. 1
li n ear (power) gai n

Gl i n

power gain in the linear region of the power transfer curve P o (dBm ) = f( Pi )

NOTE

I n this reg ion, ∆ Po (dBm ) = ∆ P i (dBm ).

3. 2
li n ear (power) gai n fl atn ess ∆ Gl i n

power gain flatness when the operating point lies in the linear region of the power transfer
curve
3. 3
power gain

Gp , G
ratio of the output power to the input power

NOTE

Usuall y the power gai n is expressed in decibels.

3. 4
(power) g ai n fl atn ess ∆ Gp

difference between the m aximum and m inim um power gain for a specified input power in a
specified frequency range
3. 5
(maxi mu m avail abl e) g ain redu cti on ∆ Gred

difference in decibels between the maximum and m inimum power gains that can be provided
by the gain control

3. 6 Ou tpu t power li m iti n g
3. 6. 1
ou tpu t power l i mitin g ran g e

range in which, for rising input power, the output power is limiting
NOTE For specificati on purposes, the lim its of this range are specifi ed by specified lower an d upper lim it valu es
for the i nput power.

3. 6. 2
li m iti n g ou tpu t power Po(l tg )

output power in the range where it is limiting

3. 6. 3
li m iti n g ou tpu t power fl atn ess ∆ Po(l tg )

difference between the maximum and minim um output power in the output power limiting
range:
∆ Po(ltg) = Po(l tg, m ax) – P o(l tg, m in)

3. 7
in termodu l ation d i storti on
Pn / P i P n / P 1

ratio of the output power of the n th order com ponent to the output power of the fundam ental
com ponent, at a specified input of the output power
Note 1 to entry: The abbreviation “ IMD n ” is in com m on use for the n th ord er i nterm odulati on distorti on.


I EC 60747-1 6-1 :2001 +AMD1 : 2007
– 11 –
+AMD2: 201 7 CSV © I EC 201 7
SOURCE: I EC 60747-4: 2007/AM D1 : 201 7, 7.2. 1 9.
3. 8
p o w e r a t t h e i n t e rc e p t p o i n t ( fo r i n t e rm o d u l a t i o n p ro d u c t s )

P
output power at intersection between the extrapolated output powers of the fundam ental
com ponent and the n th order intermodulation components, when the extrapolation is carried
out in a diagram showing the output power of the components (in decibels) as a function of
the input power (in decibels)
n (I P )

3. 9
m a g n i t u d e o f t h e i n p u t re fl e c t i o n

(input return loss)
 s 1 1  S1 1
|

c o e ffi c i e n t

|

see 3. 5. 2. 1 of I EC 60747-7 7. 4. 3.1 0.2.2 of I EC 60747-4: 2007
3. 1 0
m a g n i t u d e o f t h e o u t p u t re fl e c t i o n

(output return loss)

|

s 22  S22
|

c o e ffi c i e n t

|

see 3. 5. 2. 2 of I EC 60747-7 7. 4. 3.1 0. 2.2 of I EC 60747-4: 2007
3. 1 1

m a g n i t u d e o f t h e re v e rs e t ra n s m i s s i o n

c o e ffi c i e n t

(isolation)
 s 1 2 S1 2 |
see 3. 5. 2. 4 of I EC 60747-7 7. 4.3.1 0.2.2 of I EC 60747-4: 2007
|

3. 1 2
c o n v e rs i o n

c o e ffi c i e n t o f a m p l i t u d e m o d u l a t i o n

to p h as e m o d u l ati o n

quotient of
the phase deviation of the output signal (in degrees) by
the change in input power (in decibels) producing it

α ( AM - P M )

3. 1 3

t
ratio of the change, with angular frequency, of the phase shift through the am plifier

g ro u p d e l a y t i m e

NOTE

d ( g rp )

Usuall y g roup d elay tim e is very close in val ue to i nput-to-output delay tim e.

3. 1 4

n
P P
ratio of the power of the n th order harmonic com ponent m easured at the output port of the
device to the power of the fundam ental frequency m easured at the output port for a specified
output power
th

o rd e r h a rm o n i c d i s t o rt i o n

n th

/

ra t i o

1

3. 1 5

P
m axim um noise power measured at the output port of the device within a specified bandwidth
in a specified frequency range for a specified output power
o u tp u t n o i s e p o we r

N

3. 1 6
s p u ri o u s i n t e n s i t y u n d e r s p e c i fi e d l o a d

VS WR

P P
ratio of the power of the maximum spurious power measured at the output port of the device
to the power of the fundam ental frequency m easured at the output port under specified load
VSWR
sp

/

o


– 12 –

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

3.1 7
output power
Po
RF power measured at the output port
SOURCE: I EC 60747-4:2007/AMD1 : 201 7, 7.2. 2.

3.1 8
output power at 1 dB gain compression
Po(1 dB)

see 8. 2. 1 3 of I EC 60747-4
3.1 9
noise figu re
F
see 702-08-57 of I EC 60050-702
3.20
power added efficiency
η add

see 8. 2. 1 5 of I EC 60747-4

3.21
adjacent channel power ratio
Pad j /Po(mod)
ratio of the total output power in a specified frequency band away from a specified carrier
signal frequency to the total power in a specified carrier signal frequency band, when a
modulation signal is supplied
3.22
load mismatch tolerance
ΨL

see 7. 2. 20 of I EC 60747-4

3.23
source mismatch tolerance
ΨS

see 7. 2. 21 of I EC 60747-4

3.24

load mismatch ru ggedness
ΨR

see 7. 2. 22 of I EC 60747-4

4

Essential ratings and characteristics

4.1
4.1 .1
4.1 .1 .1

General
Circuit identification and types
Designation and types

The indication of type (device name), the category of the circuit and the technolog y applied
should be given.
Microwave am plifiers are divided into four categories:
Type A: Low-noise type.


I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7
Type B: Auto-gain control type.
Type C: Limiting type.
Type D: Power type.

4.1 .1 .2

– 13 –

General function description

A general description of the function perform ed by the integrated circuit microwave amplifiers
and the features for the application should be made.

4.1 .1 .3

M anufacturing technology

The manufacturing technology, for exam ple, semiconductor m onolithic integrated circuit, thinfilm integrated circuit, m icro-assembl y, should be stated. This statem ent should include
details of the semiconductor technologies such as MESFET, MI SFET, Si bipolar transistor,
HBT, etc.

4.1 .1 .4

Package identification

The following statements should be made:
a) I EC and/or national reference number of the outline drawing, or drawing of non-standard
package including terminal num bering;
b) principal package material; for example, m etal, ceram ic, plastic.

4.1 .1 .5

M ain application

The main application should be stated, if necessary. I f the device has restrictive applications,

these should be stated here.

4.2

Application related description

I nform ation on the application of the in tegrated circuit and its relation to the associated
devices should be given.

4.2.1

Conformance to system and/or interface information

I t should be stated whether the integrated circuit conforms to an application system and/or
interface standard or recomm endation.
The detailed inform ation about application system s, equipment and circuits such as VSAT
system s, DBS receivers, microwave landing systems, etc. , should also be given.

4.2.2

Overall block diagram

A block diagram of the applied system s should be given, if necessary.

4.2.3

Reference data

The most important properties to permit comparison between derivative types should be given.

4.2.4

Electrical compatibility

I t should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits or fam ilies of integrated circuits or whether special interfaces are required.
Details should be given of the type of the input and output circuits, for exam ple, input/output
im pedances, d. c. block, open-drain, etc. I nterchangeability with other devices, if an y, should
be given.


– 14 –
4. 2 . 5

As s o c i a t e d

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

d evi ces

I f applicable, the following should be stated here:
– devices necessary for correct operation (list with type number, nam e, and function);
– peripheral devices with direct interfacing (list with type num ber, nam e, and function).
4. 3

S p e c i fi c a t i o n

4. 3 . 1

Detai l ed

o f t h e fu n c t i o n

b l o c k d i a g ra m

– F u n cti o n a l

b l o c ks

A detail block diagram or equivalent circuit information of the integrated circuit m icrowave
amplifiers should be given. The block diagram should be com posed of the following:
1 ) functional blocks;
2) mutual interconnections among the functional blocks;
3) individual functional units within the functional blocks;
4) mutual interconnections among the individual functional blocks;
5) function of each external connection ;
6) interdependence between the separate functional blocks.
The block diagram should identify the function of each external connection and, where no
ambiguity can arise, can also show the term inal symbols and/or numbers. I f the encapsulation
has metallic parts, an y connection to them from external terminals should be indicated. The
connections with any associated external electrical elements should be stated, where necessary.
As additional inform ation, the com plete electrical circuit diagram can be reprodu ced, but not
necessaril y with indications of the values of the circuit com ponents. The graphical sym bol for
the function shall be given. This may be obtained from a catalogue of standards of graphical
symbols or designed according to the rules of I EC 6061 7-1 2 or I EC 6061 7-1 3 I EC 6061 7.
4. 3 . 2

I d e n t i fi c a t i o n

a n d fu n c t i o n o f t e rm i n a l s

All term inals should be identified on the block diagram (suppl y terminals, input or output
term inals, input/output term inals).
The terminal functions 1 )-4) should be indicated in a table as follows:
T e rm i n a l

T e rm i n a l

n u m ber

s ym b o l

1 )

T e rm i n a l

2 ) F u n c ti o n

F u n cti o n

o f t e rm i n a l

d e s i g n a ti o n
3 ) I n p u t/o u tp u t
i d e n t i fi c a t i o n

4)

T yp e o f

i n p u t / o u t p u t c i rc u i t

1 ) Terminal name
A terminal nam e to indicate the function term inal should be given. Supply terminals,
ground terminals, blank terminals (with abbreviation NC), non -usable terminals (with
abbreviation N U) should be distinguished.
2) Function
A brief indication of the terminal function should be given.
– Each function of m ulti-role terminals, that is term inals that have multiple functions.
– Each function of the integrated circuit selected by m utual pin connections,
programm ing and/or application of function selection data to the function selection pin,
such as mode selection pin.
3) I nput/output identification


I EC 60747-1 6-1 :2001 +AMD1 : 2007
– 15 –
+AMD2: 201 7 CSV © I EC 201 7
I nput, output, input/output, and multiplex input/output term inals should be distinguished.
4) Type of input/output circuits
The type of the input and output circuits, for example, input/output impedances, with or
without d. c. block, etc., should be distinguished.
5) Type of ground
I f the baseplate of the package is used as ground, this should be stated.
Exam ple:
Supply voltage

Input(s)
NU

Integrated
circuit
microwave
amplifiers

NC
Output(s)

Ground
4. 3. 3

Fu nction al d escripti on

The function perform ed by the circuit should be specified, including the following inform ation:
–
–
–
–

basic function;
relation to external term inals;
operation mode (for exam ple, set-up method, preference, etc.);
interrupt handling.

4. 3. 4

Fam il y-rel ated ch aracteri stics

I n this part, all the fam il y-specific functional descriptions shall be stated (refer to I EC 60748-2,

I EC 60748-3 and I EC 60748-4).
I f ratings and characteristics and function characteristics exist for the fam ily, the relevant part
of I EC 60748 should be used (for exam ple, for m icroprocessors, see I EC 60748-2, Chapter I I I ,
Section 3).
NOTE

For each new d evice fam ily, specific item s shall be add ed in the relevant part of I EC 60748.

4. 4

Lim i tin g valu es (absolu te m axi mu m ratin g system)

The table of these values contains the following.
a) An y interdependence of limiting conditions shall be specified.
b) I f externall y connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements conn ected and/or attached.
c) I f lim iting values are exceeded for transient overload, the perm issible excess and their
duration shall be specified.
d) Where minim um and maximum values differ during programm ing of the device, this should
be stated.
e) All voltages are referenced to a specified reference term inal ( Vss , GN D , etc. ).


– 16 –

I EC 60747-1 6-1 : 2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7
f) I n satisfying the following clauses, if m axim um and/or minim um values are quoted, the
manufacturer m ust indicate whether he refers to the absolute magnitude or to the

algebraic value of the quantity.
g) The ratings given must cover the operation of the m ulti-function integrated circuit over the
specified range of operating tem peratures. Where such ratings are temperaturedependent, this dependence should be indicated.

4.4.1

Electrical limiting values

Lim iting values should be specified as follows.
Parameters

M in.

M ax.

(1 )

Power supply voltages

(2)

Power supply cu rrents (where appropri ate)

+

+

(3)

I nput voltage(s) (where appropriate)

+

+

(4)

Output voltage(s) (wh ere appropri ate)

+

+

(5)

I nput current(s) (where appropriate)

(6)

Output current(s) (where appropri ate)

(7)

Other term inal voltage(s) (wh ere appropriate)

(8)

Other term inal cu rrent(s) (where appropriate)

(9)

Voltage difference between in put and output
(wh ere appropriate)

(1 0)

Power dissipati on

+

+
+
+

+
+

+

+
+

The detail specification may indicate those values within the table including note 1 and note 2.
Parameters (N ote 1 , Note 2)

Symbols

M in.

M ax.

Unit

NOTE 1 Where appropriate, i n accord ance with th e type of circuit consid ered.
NOTE 2 For power su ppl y vol tage ran ge:
– lim iting val ue(s) of the conti nuous voltage(s) at th e supply term inal(s) with
respect to a special el ectrical reference point;
– where appropri ate, lim iting val ue between specifi ed suppl y term inals;
– when m ore than one voltag e suppl y is requi red, a statem ent shoul d be m ade as
to wh eth er the sequ ence in wh ich these supplies are appli ed is significant: if so,
the sequ ence shoul d be stated ;
– when m ore than one suppl y is need ed, it m ay be necessary to state th e
com binations of ratin gs for these suppl y voltag es an d currents.

4.4.2
1)
2)
3)
4)

Temperatu res

Operating tem perature (ambient or reference-point tem perature)
Storage temperature
Channel temperature (type C and type D onl y)
Lead tem perature (for soldering).


I EC 60747-1 6-1 :2001 +AMD1 : 2007
– 17 –

+AMD2: 201 7 CSV © I EC 201 7
The detail specification m ay indicate those values within the table including the note.
P a ra m e t e rs ( N o t e )

NOTE
4. 5

O p e ra t i n g

S ym b o l s

Min.

M a x.

Unit

Where appropri ate, in accordance with th e type of circu it con sidered.

c o n d i t i o n s ( w i t h i n t h e s p e c i fi e d

o p e ra t i n g

t e m p e ra t u re ra n g e )

They are not to be inspected but m ay be used for quality assessment purpose.
4. 5. 1

P o w e r s u p p l i e s p o s i t i v e a n d /o r n e g a t i v e v a l u e s

4. 5. 2

I n i ti al i zati on

s e q u e n c e s ( w h e re a p p ro p ri a t e )

I f special initialization sequences are necessary, the power suppl y sequencing and the
initialization procedure should be specified.
4. 5. 3

I n p u t v o l t a g e ( s ) ( w h e re a p p ro p ri a t e )

4. 5. 4

O u t p u t c u rre n t ( s ) ( w h e re a p p ro p ri a t e )

4. 5. 5

Vo l t a g e a n d / o r c u rre n t o f o t h e r t e rm i n a l ( s )

4. 5. 6

E xt e rn a l

4. 5. 7

O p e ra t i n g t e m p e ra t u re ra n g e

4. 6

E l e c t ri c a l

e l e m e n t s ( w h e re a p p ro p ri a t e )

c h a ra c t e ri s t i c s

The characteristics shall appl y over the full operating tem perature range, unless otherwise
specified.
Each characteristic of 4.6. 1 and 4. 6.2 should be stated, either
a) over the specified range of operating temperatures, or
b) at a tem perature of 25 ° C, and at m axim um and minimum operating tem peratures.
4. 6. 1

S t a t i c c h a ra c t e ri s t i c s

The param eters should be specified corresponding to the type as follows.
P a ra m e t e r s

4. 6. 1 . 1 Power suppl y cu rrent

Min.

+

T yp .

a

+

4. 6. 1 . 2 Th erm al resistance
a

M a x.

+

T yp e s

A

B

C

D

+

+

+

+

+

+

+

Option al

The detail specification may indicate those values within the table.
C h a ra c t e ri s t i c s

a

Optional

S ym b o l s

C o n d i ti o n s

Min.

T yp .

a

M a x.

Unit


– 18 –

4.6.2

I EC 60747-1 6-1 :2001 +AMD1 : 2007

+AMD2: 201 7 CSV © I EC 201 7

Dynamic or a.c. characteristics

Each d ynam ic or a.c. electrical characteristic should be stated under specified electrical
worst-case conditions with respect to the recomm ended range of suppl y voltages, as stated
in 4. 5. 1 .
The param eters should be specified corresponding to the type as follows.
Parameters

Min.

Max.
A

4. 6. 2. 1
4. 6. 2. 2
4. 6. 2. 3
4. 6. 2. 4
4. 6. 2. 5
4. 6. 2. 6
4. 6. 2. 7
4. 6. 2. 8
4. 6. 2. 9
4. 6. 2. 1 0
4. 6. 2. 1 1
4. 6. 2. 1 2
4. 6. 2. 1 3
4. 6. 2. 1 4
4. 6. 2. 1 5

4. 6. 2. 1 6
4. 6. 2. 1 7
4. 6. 2. 1 8
4. 6. 2. 1 9
4. 6. 2. 20
4. 6. 2. 21
4. 6. 2. 22
4. 6. 2. 23
4. 6. 2. 24
4. 6. 2. 25
4. 6. 2. 26

Linear gai n
Linear gai n flatn ess
Power gai n
Power gai n flatness
Gain red uction
Output power
Output power at 1 dB gain com pression
Lim iting output power
Lim iting output power flatn ess
I nterm odul ation distorti on
Power at intercept poi nt
Noise fig ure
Magnitude of the in put reflection coefficient
(in put return loss)
Magnitude of the output reflecti on coefficient
(output retu rn loss)
Magnitude of the reverse transm ission coefficient
(isolati on )

Con version coefficient of am plitude m odul ation to
phase m odul ation (where appropriate)
Group delay tim e (where appropri ate)
Tim e constant for autom atic gain control a
Power ad ded efficiency
(wh ere appropriate)
n th ord er h arm onic distortion ratio
(wh ere appropriate) (note 2)
Output n oise power
(wh ere appropriate)
Spuri ous intensity under specified load VSWR
(wh ere appropriate) (note 2)
Adjacent chann el power ratio (where appropri ate)
Load m ism atch tolerance (where appropriate)
Source m ism atch tolerance (where appropriate)
Load m ism atch ruggedness (where appropriate)

+
+

+
+

+
+
+
+
+
+

Types
B
C
+
+
+
+
+
+
+

+
+
+

+
+

+

+
+

+

+

+

+

+

+

+

+
+
+

+

D
+
+
+
+
+
+

+
+
+
+

+
+

+

+
+b

+

+

+

+

+

+
+

+

+

+
+
+

+
+
+

+

+
+
+

+
+
+
+

NOTE 1 I t is necessary for types B an d D to select either the param eter set of 4. 6. 2. 1 , 4. 6. 2. 2 and 4. 6. 2. 7 or
that of 4. 6. 2. 3, 4. 6. 2. 4 an d 4. 6. 2. 6.
NOTE 2 Gen erall y expressed in dBc.
a
b

Und er considerati on.
Option al. For type D, the devi ces are som etim es required to specify und er l arge sign al operati on instead of
sm all signal operation. Although the defin ition is the sam e for both operatin g con ditions, the differen t
m easuring m ethod shoul d be em ployed for the param eter u nder larg e signal operation from that under sm all
signal operati on.


I EC 60747-1 6-1 :2001 +AMD1 : 2007
– 19 –
+AMD2: 201 7 CSV © I EC 201 7
The detail specification m ay indicate those values within the table.
C h a ra c t e ri s t i c s

a

4. 7

S ym b o l s

C o n d i ti o n s

Min.

T yp .

a

M a x.

Unit

Option al

M ech an i ca l

an d

e n v i ro n m e n t a l

ra t i n g s ,

c h a ra c t e ri s t i c s a n d

d a ta

An y specific mechanical and environmental ratings applicable should be stated (see also
Subclause 5. 1 0 and 5. 1 1 of I EC 60747-1 : 2006, Chapter VI , clause 7).
4. 8

Ad d i t i o n a l

i n fo rm a t i o n

Where appropriate, the following inform ation should be given.
4. 8. 1

E q u i va l e n t i n p u t an d

o u t p u t c i rc u i t

Detailed inform ation should be given regarding the type of the input and output circuits; for
exam ple, input/output impedances, d.c. block, open-drain, etc.
4. 8. 2

I n t e rn a l p ro t e c t i o n

A statement should be given to indicate whether the integrated circuit contains internal
protection against high static voltages or electrical fields.
4. 8. 3

C a p a c i t o rs a t t e rm i n a l s

I f capacitors for the input/output d. c. block are needed, these capacitances should be stated.
4. 8. 4

T h e rm a l

re s i s t a n c e

4. 8. 5

I n t e rc o n n e c t i o n s t o o t h e r t y p e s o f c i rc u i t

Where appropriate, details of the interconnections to other circuits, for exam ple, detector
circuit for AGC, sense am plifiers, buffer, should be given.
4. 8. 6

E ffe c t s o f e xt e rn a l l y c o n n e c t e d

co m p o n en t(s )

Curves or data indicating the effect of externall y connected com ponent(s) that influence the
characteristics m ay be given.
4. 8. 7

R e c o m m e n d a t i o n s fo r a n y a s s o c i a t e d d e v i c e ( s )

For example, decoupling of power supply to a high-frequency device should be stated.
4. 8. 8

H an d l i n g

p re c a u t i o n s

Where appropriate, handling precautions specific to the circuit should be stated (see also I EC

60747-1 , Chapter I X I EC 61 340-5-1 and I EC 61 340-5-2).


– 20 –

4.8.9

Application data

4.8.1 0

Other application information

4.8.1 1

Date of issue of the data sheet

I EC 60747-1 6-1 :2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

5 Measuring methods
5.1
5.1 .1

General
Characteristic impedances

The input and output characteristic im pedances of the measurement system, shown in the
circuit in this standard, are 50 Ω . I f they are not 50 Ω , they should be specified.

5.1 .2

General precautions

The general precautions listed in clause 2 6. 3, 6. 4 and 6. 6 of I EC 60747-1 : 2006, Chapter VI I ,
Section One appl y. I n addition, special care should be taken to use low-ripple d. c. supplies
and to decouple adequatel y all bias suppl y voltages at the frequency of measurem ent. Also
special care about the load im pedance of the test circuit should be taken to m easure the
output power.
The power levels are indicated by using the unit "dBm". The unit "dBm " expresses decibel
referred to 1 mW.

5.1 .3

Handling precautions

When handling electrostatic-sensitive devices, the hand ling precautions given in clause 1 of
I EC 60747-1 , Chapter I X I EC 61 340-5-1 and I EC 61 340-5-2, shall be observed.

5.1 .4

Types

The devices in this standard are both package and chip types, measured using suitable test fixtures.

5.2
5.2.1

Linear (power) gain ( Gli n )
Purpose

To m easure the linear gain under specified conditions.


I EC 60747-1 6-1 : 2001 +AMD1 : 2007
+AMD2: 201 7 CSV © I EC 201 7

5.2.2

– 21 –

Circuit diagram
Frequency
meter

Variable
attenuator

Isolator

E

Directional
coupler

B

A

Signal

generator

Power
meter 1

C

Device
being
measured
Bias
supply

Directional
coupler

Spectrum
analyser

D
Power
meter 2
IEC

2246/01

Figure 1 – Circuit for the measurements of linear gain
5.2.3

Principle of measurement

I n the circuit diagram shown in figure 1 , the input power Pi and the output power P o of the
device being measured are derived from the following equations:

Pi = P 1 + L 1
Po = P 2 + L 2

(1 )
(2)

where P 1 and P 2 are the value indicated by the power meters 1 and 2, respectivel y.

L1 = LA – LB
where L A is the loss from point E to point A and L B is the loss from point E to point B shown in

figure 1 , respectivel y.

L 2 is the circuit loss from point C to point D shown in figure 1 . Pi , P o , P1 and P2 are expressed
in dBm. L 1 and L 2 are expressed in decibels.
Power gain G p in dB is derived from equation (1 ) and (2) as follows:

G p = Po – Pi

(3)

The linear gain Gl in is the power gain measured in the region where the change of the output
power in dBm is the same as that of the input power.

5.2.4

Circuit description and requirements

The purpose of the isolator is to enable the power level to the device being m easured to be
kept constant irrespective of im pedance m ismatches at its input.
The circuit losses L 1 and L 2 should be m easured beforehand.

5.2.5

Precautions to be observed

Oscillation, which is checked by a spectrum anal yser, should be eliminated during these
m easurem ents. The termination must be capable of handling the power fed.