An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 16 potx

Polymerase chain reaction (continued)
on a chip, 174–76
defined, 174
Polymers, 21, 23
defined, 23
forms, 21
parylenes, 23
photoresist, 21
polyimide, 21, 23
Polysilicon, 14, 17–18
beam structures, 18
deposition of, 38
importance, 17
mechanical properties, 17
piezoresistive effect, 26
surface micromachining, 69–71
Population inversion, 143
Potassium hydroxide (KOH), 16
etch rate, 47
as KOH, 46
Pressure sensors, 89–93
fabrication process, 91
high-temperature, 93–94
schematic illustration, 90
silicon-fusion-bonded, 91
See also Sensors
Principle axes, 15
Protective coatings, 222–23
Psychological barrier, 8–9
Q
Quality control, 244–46

Quartz
crystals, 201
micromachining, 21
as piezoelectric material, 29
R
Reactive ion etching (RIE), 51–52
Redwood Microsystems valve, 120–22
defined, 120
fabrication steps, 121
illustrated, 120
operating mechanism, 121
See also Micromachined valves
Reliability, 243–56
accelerated life modeling, 248–49
bath-tub relationship, 248
case study, 254–56
defined, 246
GR-CORE series, 245
ISO 9000/QS 9000, 244
standards, 244–46
statistical methods in, 246–48
tests, 246
See also Failure(s); Quality control
Resonators, 200–211
beam, 203–6
comb-drive, 201–3
coupled-resonator bandpass filter, 206–8
film bulk acoustic, 208–11
microelectromechanical, 200–211
See also RF MEMS

RF MEMS, 189–214
devices, 189
losses, 190
low-resistivity metals, 190
microelectromechanical resonators,
200–211
microelectromechanical switches, 211–14
passive electrical components, 190–200
signal integrity, 189–90
Room-temperature vulcanizing (RTV) rubbers,
227, 252
S
Santur DFB tunable laser, 148–51
Screen printing, 65–66
defined, 65
illustrated, 65
process, 65–66
Seebeck effect, 29, 30
coefficients, 30
defined, 29
thermocouple structure using, 30
Self-assembled monolayers (SAM), 61
coating process, 61
electromagnetic, 82
precursors, 61
Sensing
capacitive, 82
methods, 81–82
objective, 81
piezoresistive, 81–82

Sensors, 89–116
acceleration, 96–114
angular rate, 104–7
carbon monoxide gas, 114–16
high-temperature pressure, 93–94
mass flow, 94–96
pressure, 89–93
protective coatings, 222–23
stress-sensitive, 222
Sensors and Actuators (A, B, C), 9
280 Index
Sensors Magazine, 10
Shape-memory alloys, 23–24
actuation with, 85
critical temperature and, 23–24
Shocks, 251–52
Side-shooter nozzles, 87
Silicon, 13–19
amorphous, 14, 17–18
crystalline, 14–17
defined, 13
interactions, 18
mechanical integrity and, 18
micromachining, 33
microstructures, 14
optical reflectivity, 18
polysilicon, 14, 17–18
properties, 14
surface oxidation, 18
as thermal conductor, 18

Silicon carbide, 22
Silicon dioxide, 38–39
Silicon direct bonding, 56–57
defined, 56
performance, 56
process, 56–57
Silicon-fusion bonding, 94
Silicon fusion bonding with reactive ion
etching (SFB-DRIE), 71
defined, 71
high aspect ratio, 71
illustrated, 72
Silicon nitride, 19
deposition of, 39–40
LPCVD, 48
Silicon-on-sapphire (SOS) wafers, 35
Silicon oxide, 19
Silk screening. See Screen printing
Single-crystal reactive etching and
metallization (SCREAM) process,
72–74
defined, 72
development, 74
illustrated, 74
Sliding plate microvalve, 124–26
defined, 124
designs, 126
fabrication, 126
schematic cross section, 125
See also Micromachined valves

Small Times Magazine, 10
Soft lithography, 66–67
Sol-gel process, 58
Spin-on methods, 40
Sputter deposition, 35–36
defined, 35
directional randomness, 36
planar/cylindrical magnetron, 36
Stiction, 253
Stress isolation, 221–22
SU-8 photosensitive epoxy, 61–62
defined, 61
structures, 62
use of, 62
Supercritical drying, 60–61
Surface-micromachined variable capacitors,
192–97
design, 194
etch holes, 195
fabrication, 192–93, 194
implementations, 193
in portable applications, 193
versions, 193
See also Capacitors
Surface micromachining
polysilicon, 69–71
schematic illustration, 70
systems of materials for, 70
Surface mount technologies (SMT), 217
Switches, 211–14

cantilever, 212, 213–14
desirable parameters, 211
membrane, 212, 213
prototypes, 211
See also RF MEMS
T
Tape peel test, 253
TaqMan tagging, 175, 176
Tetramethyl ammonium hydroxide (TMAH),
48, 112
Thermal actuation, 84
Thermal failures, 254
Thermal inkjet heads, 116–19
concept, 117
fabrication, 117–18
fabrication illustration, 118
nozzles, 116
Thermal management, 220–21
Thermoelectric coolers (TECs), 29
Thermoelectricity, 29–30
Thermosonic gold bonding, 228
Thin metal films, 20–21
choice of, 20
etching, 44
Index 281
TiNi Alloy Company valve, 122–23
metals, 20
defined, 122
fabrication sequence, 123
illustrated, 122

performance, 123
See also Micromachined valves
Titanium-nickel alloys, 24
Transition temperature, 23, 24
Transportation Recall Enhancement,
Accountability, and Documentation
(TREAD), 6
Tunable lasers, 142–51
as bench-top test instruments, 142
building blocks illustration, 143
DFB, 148–51
elements, 143
external cavity, 144–48
metal packaging, 238–39
specifications, 144
tuning operations, 144
U
Ultraprecision mechanical machining, 64
Ultrasonic machining, 68
V
Valves. See Micromachined valves
Vanishing dipole, 28
Variable optical attenuators (VOAs), 142,
161–65
cross-sectional schematic, 164
defined, 161
diffraction operation, 163
fabrication, 165
key characteristics, 161
principle of operation, 162

Voltage-controlled oscillators (VCOs), 192
Volume manufacturing, 8
W
Wafers
dicing concerns, 219–20
thickness, 219
Wavelength-division multiplexing (WDM),
142
Wavelength locker, 151–54
defined, 151
elements, 152
etalon, 153
schematic illustration, 153
Wire bonding, 227–29
aluminum, 228
gold, thermosonic, 228
limitations, 229
See also Electrical interconnects
Y
Yaw-rate sensor, 112
282 Index
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