Heat Transfer Handbook part 148 pptx

BOOKCOMP, Inc. — John Wiley & Sons / Page 1470 / 2nd Proofs / Heat Transfer Handbook / Bejan
1470 SUBJECT INDEX
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29

30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
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for boiling, 713
for conduction heat transfer, 257
for direct contact heat transfer, 1395

for electronic equipment, 1020–1022
for enhancement techniques, 1104
for forced convection (internal flows), 436
Greek letter, 41
for heat exchangers, 903–905
for heat pipes, 1226–1227
for manufacturing and materials
processing, 1301
for microscale heat transfer, 1354
for porous media, 1175–1176
Roman letter, 40–41
for thermal spreading and contact
resistances, 384–385
thermophysical properties, 142
Substantial derivative, 18
Substrates, 288
block arrays, 495–497
flush-mounted heat sources, 491–492
forced convection external flows from,
490–500
isolated blocks, 493–495
objects on, 444, 490–500
pin fin heat sinks, 498–500
plate fin heat sinks, 497–498
two-dimensional block array, 492–493
Suction, 1034
Sulfur dioxide, 87–88
Sulfur hexafluoride, 88
Summation rule, 606–607
Supercritical startup, 1216–1217

Superficial vapor velocity, 742, 743
Superficial velocities, 1377
Superheat:
critical, 1201
nucleation, 640–644
Superposition, 221–222, 496
Superscripts, 41
for condensation, 789
for conduction heat transfer, 257
“crit” (critical enhancement), 115
for electronic equipment, 1022
for external flow forced convection, 522
for forced convection (internal flows), 436
for heat exchangers, 905
“int” (internal motions), 115
for manufacturing and materials
processing, 1301
for thermal radiation, 631
for thermal spreading and contact
resistances, 385
thermophysical properties, 142
“trans” (translational term), 115
Surfaces:
diffuse, 600
enhanced boiling, 704
extended, see Extended surfaces
with flow normal to banks of smooth tubes
compact heat exchangers, 845–846
rough, see Rough surfaces
thermal radiation between, 598–615

black surfaces, 609–610
diffuse gray surfaces, 610–612
diffuse nongray surfaces, 614–615
radiation shields, 612–613
view factors, 600–609
total emittance/solar absorptance of
selected, 597–598
treated, see Treated surfaces
Surface conditions:
effects of, on nonconductors, 593–594
nonconductors affected by, 593–595
thermal radiation affected by, 593–595
Surface convection:
one-region Neumann problem with, 250
semi-infinite solid model and, 232–233
Surface heat flux:
semi-infinite solid model, 232–234
semi-infinite solid with periodic, 240
Surface heat treatment, 1246
Surface layers, 594–595
Surface properties, 599
Surface radiosity, 611
Surface roughness:
and grease thermal conductivity, 376
and grinding, 1251
nucleate pool boiling, 655–656
reduced pressure correlation of Cooper,
655–656
Surface roughness effect, 481–482
Surface scraping devices, 1097

Surface temperature:
arbitrarily varying, 465–466
finite plane wall with periodic, 241–242
radiative properties of metals, 588–589
BOOKCOMP, Inc. — John Wiley & Sons / Page 1471 / 2nd Proofs / Heat Transfer Handbook / Bejan
SUBJECT INDEX
1471
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23

24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
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semi-infinite solid model, 232–233
specified, 232–233
uniform
axisymmetric object at, in uniform
laminar flow, 510
crossflow across bank of cylinders at,
511
cylinder at, in laminar cross flow, 509
Surface temperature effects, 588–589
Surface tension, 739, 1191
Surface tension devices, 1033
Surface tension pressure gradient, 724–725
Surface vibration, 1033, 1097
Swirl effects, 708, 767–769
Swirl flow devices, 1033
boiling, 1082–1086
condensing, 1087–1088
heat transfer enhancement, 1075–1088
single-phase flow, 1075–1082
Symbols:
Greek letter, see Greek letter symbols
Roman letter, see Roman letter symbols
Symmetric isoflux plates, 990
Symmetric isothermal plates, 990
Système International d’Unités (SI System),
35–38
Taitel—Dukler map, 739–741, 744–746, 760
Tantalum, 129
Taylor bubbles, 663

Taylor instability, 658
TECs, see Thermal electric coolers
Teflon, 373
TEMA, see Tubular Exchanger Manufactur-
ers’ Association
TEMA E-shell, 811–813
TEMA G-shell, 813–814
TEMA J-shell, 814, 817
Temperature:
adiabatic, 496
boiling point for fluids, 48, 52–54
calibrating for, 916–917
critical, 48, 52–54
effective solar, 576
and electronic equipment, 948–953
finite plane wall with periodic, 241–242
and grinding, 1252–1254
horizontal tubes affected by, 750–751
longitudinal finned double-pipe heat
exchangers, 865
maldistribution of, 770
and metal cutting, 1248–1250
mixture, 114
periodic conduction
oscillating, 239
semi-infinite solid with periodic
ambient, 240–241
semi-infinite solid with periodic surface,
239–240
plane wall with constant, 1141–1142

porous media, 1141–1142
semi-infinite solid model
constant surface heat flux and
nonuniform initial, 234
specified surface, 232–233
surface, 241–242
triple-point, 48, 52–54
uniform surface
axisymmetric object at, in uniform
laminar flow, 510
crossflow across bank of cylinders at,
511
cylinder at, in laminar cross flow, 509
wall, 865
wedge at uniform, 509
X-shell condensers, 770
Temperature change (in solids), 120
Temperature dependence, 592, 593
Temperature-dependent energy generation,
199–200
Temperature-dependent heat transfer
coefficient, 231
Temperature-dependent specific heat, 230
Temperature-dependent thermal conductiv-
ity, 196–198
Temperature difference, logarithmic mean,
804–805
Temperature gradient, 164
Temperature head, 819
Thermal boundary resistance, 970, 972–973,

1351
Thermal capacitance, 7
Thermal conductivity, 115, 164–165
dilute gas, 58–59
in ECS model, 117
graphs of, 149–150, 152, 154, 156, 158
location-dependent, 194–195
BOOKCOMP, Inc. — John Wiley & Sons / Page 1472 / 2nd Proofs / Heat Transfer Handbook / Bejan
1472 SUBJECT INDEX
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21

22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
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Thermal conductivity (continued)
measurement of, 122, 140
microscale heat transfer, 1326–1330
in mixtures, 117–118
of particle-laden systems, 975–979
of solids, 119–120
temperature-dependent, 196–198
Thermal contact resistance, see Contact
resistance
Thermal diffusivity:
and conservation of energy, 120
graphs of, 151, 153, 155, 157, 159
measurement of, 140
Thermal diodes, 1187
Thermal elastoconstriction parameter, 324
Thermal electric coolers (TECs), 1016–1017
Thermal entrance length, 396
Thermal entrance region, 407–408
Thermal expansion:
measurement of, 140
volumetric coefficient of, 28
Thermal—fluid design general considera-
tions, 1000–1001
Thermal-fluid effects in continuous metal
forming processes, 1254–1259

Thermal greases and pastes, 374–376
Thermal heat radiation, see Thermal radiation
Thermally and hydraulically developing
flow, 430
Thermally conductive, 289
Thermally decoupled model, 325
Thermally developing flow, 412–413, 429
Thermally developing Hagen—Poiseuille
flow, 429–430
Thermally fully developed flow, 405–407
Thermally resistive, 289
Thermal management, 948–952
Thermal model:
metallic coatings and foils, 264, 366–371
thermosetting-matrix composites
processing, 1261–1262
Thermal nonequilibrium, 690–693
Thermal packaging goals, 952–953
Thermal process control for manufacturing,
1284–1297
adaptive control, 1294–1296
MIMO thermal systems, 1288–1290
optimal formulation: linear quadratic
Gaussian, 1290–1292
parameter identification, 1296–1297
SISO thermal systems, 1285–1288
sliding mode control, 1293–1294
Smith prediction, 1292–1293
Thermal radiation, 2, 573–631
definition of, 574

emissive power, 575–579
nomenclature for, 629–631
radiative exchange within participating
media, 621–629
diffusion approximation, 623, 624
discrete ordinate method, 627
mean beam length method, 623, 624
Monte Carlo or statistical methods, 627
P-1 approximation, 625–626
weighted sum of gray gases, 627–628
zonal method, 627
radiative heat flux, 581–582
radiative heat transfer, 12
radiative intensity, 581
radiative properties of participating media,
615–621
molecular gases, 615–619
particle clouds, 619–621
radiative properties of solids and liquids,
582–598
metals, 586–589
nonconductors, 589–593
semitransparent sheets, 596
surface conditions’ effects on, 593–595
solid angles, 577, 579–581
between surfaces, 598–615
black surfaces, 609–610
diffuse gray surfaces, 610–612
diffuse nongray surfaces, 614–615
radiation shields, 612–613

view factors, 600–609
Thermal resistance, 2
in electronic equipment, 956–964
basic heat transfer modes, 956–962
chip package resistance, 962–964
in heat pipes, 1209–1211
and steady one-dimensional conduction,
182–183
Thermal spreading and contact resistances,
261–385
assumptions for resistance/conductance
model development, 270
at bolted joints, 378
BOOKCOMP, Inc. — John Wiley & Sons / Page 1473 / 2nd Proofs / Heat Transfer Handbook / Bejan
SUBJECT INDEX
1473
1
2
3
4
5
6
7
8
9
10
11
12
13
14

15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

45
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circular flux tube with multiple layers,
302–304
within compound disk with conductance,
288–294
in compound rectangular channels,
304–309
rectangle on isotropic half-space, 309
rectangle on layer on half-space, 309
square area on semi-infinite square flux
tube, 309
conforming rough solids, 266–267
conforming rough surface, 340–362
elastic contact model, 349–351
elastic—plastic contact conductance
model, 351–353
gap conductance for joints between,
355–359
gap conductance for large parallel
isothermal plates, 353–355
joint conductance for joints between,

359–361
models for, 340–342
plastic contact model, 342–347
radiation resistance/conductance for,
347–349
definitions
in flux tubes/channels, 272–274
in isotropic half-space, 270–272
eccentric rectangular area on rectangular
plate with cooling, 314–318
multiple rectangular heat sources on
isotropic plate, 317–318
ingle eccentric area on compound
rectangular plate, 316–317
of isotropic finite disks with conductance,
294–298
circular area on single layer (coating)
on half-space, 295–296
correlation equations, 294–295
equivalent isothermal contact area,
297–298
isoflux circular contact, 296–297
isoflux contact area, 297
isothermal contact area, 298
in isotropic half-space, 274–280
circular source areas, 274–277
dimensionless spreading resistance,
279–280
flux distribution over isothermal
elliptical area, 280

isoflux circular source, 275–277
isothermal circular source, 274–275
isothermal elliptical source area,
277–280
transient spreading resistance, 285–288
joint conductance enhancement methods,
361–377
elastomeric inserts, 372–374
metallic coatings and foils, 363–372
phase-change materials, 377
thermal greases and pastes, 374–376
nomenclature for, 378–385
nonconforming rough solids, 268
nonconforming smooth solids, 267–268,
318–340
ball-bearing resistance, 336
contact resistance of isothermal
elliptical contact areas, 323–324
elastic—plastic contacts of hemispheres
and flat surfaces in vacuum, 333–
335
elastogap resistance model, 324–326
line contact models, 336–340
local gap thickness, 322–323
models for, 318–319
point contact model, 319–322
radiative resistance, 326–327
sphere and layered substrate, 329–333
sphere—flat contact, 327–329
parameters influencing resistance/

conductance, 269–270
of rectangular source area, 280–285
arbitrary singly connected area, 282–
283
circular annular area, 283–284
doubly connected regular polygons,
284–285
isoflux rectangular area, 280
isoflux regular polygonal area, 281–282
isothermal rectangular area, 281
semi-infinite circular flux tubes and
two-dimensional channels, 313–314
semi-infinite isotropic circular flux tube,
298–302
accurate correlation equations, 302
general expression, 299–302
BOOKCOMP, Inc. — John Wiley & Sons / Page 1474 / 2nd Proofs / Heat Transfer Handbook / Bejan
1474 SUBJECT INDEX
1
2
3
4
5
6
7
8
9
10
11
12

13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42

43
44
45
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single layer between two conforming
rough solids, 268–269
Thermal spreading and contact resistances
(continued)
solids
conforming rough, 266–267
conforming rough, single layer between,
268–269
nonconforming rough, 268
nonconforming smooth, 267–268
from strip on finite channel with cooling,
310–311
from strip on infinite flux channel,
312–313
types of joints, 264–266
Thermal switches, 1187

Thermal time constant, 7
Thermal transport, 500–502
Thermal vias, 987–988
Thermal waves, 1343
Thermal wave propagation, 981
Thermistors, 942
Thermocouples, 140, 915, 933–941, 1339–
1341
arrangements of, 938–940
common standard, 938
nanometer-scale, 1339, 1340
Thermodynamics:
first law of, 23–24
second law of, 35–37
Thermodynamic properties:
of fluids, 46–114
of mixtures, 113–114
Thermoelectric power, 936, 1350
Thermogram, 1263
Thermohaline convection, 1169
Thermomechanical model, 366
Thermometers, 916–918, 931–933
Thermophysical properties, 43–142, 149–
159
of fluids, 46–118
along the saturation line, 62–110
calculation of, 112–113
dilute gas thermal conductivity, 58–59
dilute gas viscosity, 60–61
equation of state, 46–51, 111–112

estimated experimental uncertainty, 47
ideal gas isobaric heat capacity, 55–57
for mixtures, 113–114
physical constants and fixed points,
52–54
BOOKCOMP, Inc. — John Wiley & Sons / Page 1475 / 2nd Proofs / Heat Transfer Handbook / Bejan
SUBJECT INDEX
1475
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22

23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
[1475], (49)
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thermodynamic properties, 46–114
transport properties, 114–118
graphs of, 149–159
nomenclature for, 141–142
saturation line, 62–110
of solids, 118–140
behavior of, 120–121
conservation of energy, 119–120
measuring, 122, 140
property values of, 121–139
as term, 44
transport properties, 62–110
Thermophysical Properties Research Center
(TPRC), 121
Thermoplastic-matrix composites, 1269–
1283
fabrication of composites, 1270–1271
heat transfer, 1273–1274
interlaminar bonding, 1277–1280
polymer degradation, 1280–1281
solidification (crystallization), 1281–1283
stages of, 1269–1270
transport mechanisms involved in, 1271–
1273
void dynamics, 1274–1277
Thermoreflectance techniques, 1339

Thermosetting-matrix composites, 1259–
1269
kinetics model, 1262–1266
laminate consolidation model, 1266–1269
thermal model, 1261–1262
Thermostatic (on—off) control, 1285–1286
Thermosyphon, 1196
Thin-film evaporation, 705
Thin-film microbridge, 1342, 1343
Thin plate with moving heat source, 1241–
1243
Thin rod with moving planar heat source,
1241–1242
Thin solid model, 1235–1239
Thome method, 700–701
Thomson functions, 176–177
3ω technique, 1342–1344
Three-layer model for a “physical situation,”
476–479
Three-phase exchanges, 1368
Three-phase spray column, 1381–1384
Three-time-level scheme, 238
Tien model, 754
Time-averaged equations, 419–420
Time—temperature transformation (TTT)
diagram, 1245–1246
Tin, 129, 370, 371
Titanium, 130
Toluene (methylbenzene), 88–89
Tool—chip interface temperature rise,

1248–1249
Total, normal emittance, 597–598
Total emissive power, 575
Total heat transfer rate, 425–427, 433
Total hemispherical emittance, 585, 588, 589
Total properties, 588
Total resistance, 964
Total temperature potential, 867
Tow compaction, 1273, 1274
Tow-placement head, 1270
TPRC (Thermophysical Properties Research
Center), 121
Trace layers, 988
Transfer unit technique, 1374–1375
Transient conduction, 229–239
finite-difference method, 236–239
finite-sized solid model, 235–236
lumped thermal capacity model, 229–231
multidimensional, 236
semi-infinite solid model, 232–234
Transient effects, first-order, 979–985
Transient natural convection in external
laminar flow, 546–548
Transient operation, heat pipe, 1212–1217
continuum vapor and liquid-saturated
wick, 1212–1213
freeze—thaw issues, 1214–1216
supercritical startup, 1216–1217
wick depriming and rewetting, 1213
Transient spreading resistance, 285–288,

313–314
Transient thermoreflectance (TTR), 1344–
1347
Transistors, 1347–1349
Transition boiling, 639
boiling curve, 637
pool boiling, 662
Transition flow, 830
Transition region, 10, 528
Transition temperature, 1271
Translational term (superscript “trans” ), 115
Transmissivity, 583
BOOKCOMP, Inc. — John Wiley & Sons / Page 1476 / 2nd Proofs / Heat Transfer Handbook / Bejan
1476 SUBJECT INDEX
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
[1476], (50)

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Transmittance, 583
Transport, convection, 446
Transport correlations, 482–483
Transport equations, 49–51
Transport limitations, heat pipe, 1193–1209
boiling limit, 1201–1202
capillary limit, 1195–1201
condenser limit, 1208–1209
entrainment limit, 1202–1204
leading to failure, 1194
nonfailure, 1194
sonic limit, 1206–1208
viscous limit, 1205
Transport mechanisms, 1271–1273
Transport properties, 44–45
density-dependent contributions, 116–117
dilute-gas contributions, 115–116
extended corresponding states, 114–115
of fluids, 114–118
for mixtures, 117–118
Transverse high-fin heat exchangers, 868–
878

air-fin coolers, 871–875
bond/contact resistance of high-fin tubes,
870
fin efficiency approximation, 871
overall heat transfer coefficient, 876–878
pressure loss correlations for staggered
tubes, 875–876
Trapezoidal fins, 203, 205
Trapezoidal fin tubes, 728–730
Trap wicks, 1191
Travel Péclet number, 1367
Treated surfaces, 1032, 1043–1050
boiling, 1043–1049
condensing, 1049–1050
Triangular cavity, nucleation on, 643
Triangular fins:
longitudinal convecting, 203, 205
optimal dimensions of convecting, 212,
213
radial convecting, 208
Triple-point temperature, 48, 52–54
True isothermal strip on infinite flux channel,
312
TTR, see Transient thermoreflectance
TTT diagram, see Time—temperature
transformation diagram
Tubes:
air-fin cooler arrangements of, 872–874
BOOKCOMP, Inc. — John Wiley & Sons / Page 1477 / 2nd Proofs / Heat Transfer Handbook / Bejan
SUBJECT INDEX

1477
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29

30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
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Tubes (continued)
coiled, 1033, 1088–1092
boiling, 1091–1092

condensing, 1092
single-phase flow, 1088–1091
condensation in smooth, 735–763
enhanced in-tube condensation, 764–767
exchanger surface area, 800–802
film condensation on, 727–732
horizontal, 749–761
horizontal finned, 727–732
laminar force convection in circular, 959,
960
low-finned, 706
microfin, 706–708, 764–767
in shell-and-tube heat exchangers
heat transfer data, 829–832
physical data, 825
pressure loss data, 836–838
smooth, see Smooth tubes
Turbo-Bii, 706
turbulent force convection in circular, 959,
960
Tube banks, 442, 483–485
Tube bundles:
film condensation on, 769–780
in-tube condensers, 779–780
X-shell condensers, 769–779
flow boiling on, 687–689
bundle boiling factor, 688
bundle design methods, 688–689
heat transfer characteristics, 687–688
Tube diameter:

flow regimes, 738
heat transfer, 750
Tube metal resistance, 878
Tube-side flow, 770
Tubular Exchanger Manufacturers’
Association (TEMA), 811, 823,
894, 896
Tubular surfaces, 844
Tungsten, 130, 590
Turbo-Bii tube, 706
Turbo-Cdi, 731
Turbo-Chil, 731
Turbulence, 557–560
Turbulent boundary layer:
flat plate with, 510
forced convection external flows from,
469–472
isothermal rough flat plate with, 510–511
uniform flux plate with, 510
Turbulent boundary layer transition, 510
Turbulent duct flow, 419–425
fully developed flow, 420–423
heat transfer in fully developed flow,
423–425
optimal channel sizes for, 431–432
optimum channel sizes for, 427
time-averaged equations, 419–420
Turbulent flow, 528
and entrance lengths, 432
external flow forced convection, 472–475

flat plate with unheated starting length in,
479–480
natural convection in, 557–560
near-wall region in, 472–475
optimal channel sizes, 432
in shell-and-tube heat exchangers, 830–
831
swirl flow devices, 1080–1082
Turbulent flow friction factor, 432
Turbulent flow heat transfer, 432–433
Turbulent force convection, 959, 960
Turbulent jets:
external flow forced convection, 500–508
submerged jets, 502–508
thermal transport in jet impingement,
500–502
Twisted duct, 1076
Twisted-tape inserts:
boiling, 1082–1086
condensation enhanced in-tube, 767–769
condensing, 1087–1088
enhanced in-tube condensation, 767–769
single-phase flow, 1076–1082
Two-dimensional block array, 492–493
Two-dimensional nonsimilar flows, 466
Two-dimensional steady conduction, 215–
229
conduction shape factor method, 222–225
finite-difference method, 223, 225–229
method of superposition, 221–222

rectangular plate with specified boundary
temperatures, 216–217
solid cylinder with surface convection,
217–220
BOOKCOMP, Inc. — John Wiley & Sons / Page 1478 / 2nd Proofs / Heat Transfer Handbook / Bejan
1478 SUBJECT INDEX
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24

25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
[1478], (52)
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[1478],
(52)
solid hemisphere with specified base and
surface temperatures, 219–221
Two-dimensional workpieces, 1238, 1240–
1241
Two pass/one pass flow arrangement, 882
Two pass/two-pass flow arrangement, 882
Two-phase flow heat transfer:
condensation in smooth tubes, 736–737
enhancement of, 1040–1042
Two-phase flow patterns, 662–671
Two-phase multiplier correlations, 756–757
Two-phase system, capillary-driven, 1182,
1183
Two-point basis, 1313
Two-region Neumann problem, 245–247
2/1 arrangement, 882
2/2 arrangement, 882
U arrangement, 881, 882
Umklapp process (of phonon—phonon
colllisions), 1328, 1329
Uncertainty:
estimated experimental, 47
measurement error, 918–920
Unconfined flow, 502
Unheated starting length:
external flow forced convection, 463–466
flat plate boundary layer with, 463–466
flat plate with, 479–480, 509

in turbulent flow, 479–480
uniform laminar flow with, 509
Uniform energy generation, 201
Uniform flow, forced convection external
flows from single objects in, 446–483
algebraic turbulence models, 472
analogy solutions for boundary layer flow,
475–481
axisymmetric nonsimilar flows, 469
cylinder in crossflow, 482–483
flow over isothermal sphere, 483
high Reynolds number flow over a wedge,
446–452
incompressible flow past flat plate with
viscous dissipation, 461–463
integral solutions for flat plate boundary
layer with unheated starting length,
463–466
near-wall region in turbulent flow, 472–475
Prandtl number effect, 459–460
similarity solutions for flat plate at uniform
temperature, 456
similarity solutions for wedge, 456–459
similarity transformation technique for
laminar boundary layer flow, 452–455
Smith—Spalding integral method, 466–
468
surface roughness effect, 481–482
turbulent boundary layer, 469–472
two-dimensional nonsimilar flows, 466

Uniform flux plate, 510
Uniform heat flux, 433
Uniform internal energy generation effect,
188–194
Uniform laminar flow:
axisymmetric object at uniform surface
temperature in, 510
flat plate in, with unheated starting length,
509
isothermal flat plate in, 508–509
Uniformly heated wall, 427
Uniform surface temperature:
axisymmetric object at, in uniform laminar
flow, 510
crossflow across bank of cylinders at, 511
cylinder at, in laminar cross flow, 509
Uniform thermal environment:
moving materials in, 1234–1241
thin solid model, 1235–1239
two-dimensional workpieces, 1238,
1240–1241
wedge at, 509
Units, 34–38
conversion factors, 37–38
English engineering system, 36–37
SI System, 35–36
Unit cells, 1312
Unit vectors, 606
Uranium, 130
Vacuum:

coated joint operating in, 363
joint resistance in a, 328, 330, 333–335,
339
Vafai and Tien flow model, 1137–1138
Vanadium, 130
Van Stralen bubble growth model, 648
Vapor, evaporation of a liquid by a
surrounding gas, 1371–1373
BOOKCOMP, Inc. — John Wiley & Sons / Page 1479 / 2nd Proofs / Heat Transfer Handbook / Bejan
SUBJECT INDEX
1479
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9
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12
13
14
15
16
17
18
19

20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
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[1479], (53)
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[1479],
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Vapor chambers, 1008
Vapor flow-modulated heat pipes, 1189, 1190
Vapor inertia, 1204
Vapor-liquid equilibria and properties,
699–700
Vapor—liquid exchange, 653
Vapor space, 721–723
Vapor space EHD condensation, 733
Vapor-to-droplet heat transfer, 694
Vapor velocity, modified superficial, 742,
743
Variable conductance heat pipes (VCHPs),
1217–1218
Varisol, 1386
VCHPs, see Variable conductance heat pipes
VCSELs (vertical cavity surface-emitting
laser diodes), 1349
Velocity:
friction, 421
in fully developed flow region, 399–400
slip, 1377
superficial, 1377
Vent flow rate, 777–779

Venting, noncondensable gas, 777–779
Vertical cavity surface-emitting laser diodes
(VCSELs), 1349
Vertical cylinder, 545–546
Vertical flat plate, 721–723
Vertical flat surfaces:
laminar flow, 533–540
turbulent flow, 561–562
Vertical isoflux surface, 959, 960
Vertical row-number method, 771–772
Vertical surfaces, 959, 960
Vertical tubes:
flow boiling in, 663–664, 666, 671–679
Chen correlation, 672–673
Gungor—Winterton correlation, 674–
675
horizontal tube correlations based on,
679–680
Shah correlation, 673–674
Steiner—Taborek method, 675–678
smooth tube condensation, 763
Vertical walls, 1147–1153
Very large scale integration (VLSI) chips,
949
VG criteria, 1038
Vias, themal, 987–988
Vibration(s), 1097–1098
enhancement techniques, 1033
fluid, 1033, 1098
Vibrational modes of a crystal, 1317–1322

Vickers microhardness, 343–346
View factors:
in electronic equipment, 961
evaluation of, between two surfaces, 605
graphs of, 604–605
radiative exchange between surfaces,
600–609
crossed-strings method, 608–609
direct integration, 600, 606
reciprocity rule, 607
summation rule, 606–607
view factor algebra, 607–608
thermal radiation, 600–609
types of, 601–603
View factor algebra, 607–608
Viscosity, 115
Chapman—Enskog dilute gas, 115
dilute gas, 60–61
in ECS model, 117
graphs of, 150, 152, 154, 156, 158
of mixtures, 118
resin, 1268
Viscous dissipation:
incompressible flow past flat plate with,
461–463
isothermal flat plate in uniform laminar
flow with appreciable, 508–509
Viscous dissipation function, 27–30
Viscous limit, 1194, 1205
Viscous sublayer, 473

VLSI (very large scale integration) chips,
949
Void compression, 1276
Void dynamics, 1274–1277
Void fraction, 1361
Void fraction model, Rouhani—Axelsson
drift flux type of, 682
Void growth, 1277
Volatile component, 699
Volume-averaged quantity, 1132
Volumetric coefficient of thermal expansion,
28
Von Kármán constant, 474
Wakes, 548–551